3.5 D

Owners

Goods & Services

Common metals and their alloys, unwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastes, soft solder films, foils, fluids and powder

Industrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancy, in the technology field of the manufacture of microconnections

Machines, machine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electrical, mechanical and optical components for the manufacture of transponders, sensors and semiconductor wafers, and integrated circuits affixed thereto; machines, machine tools and power tools in the field of microperipheric technologies, namely, autogenous soldering machines, electric welding machines, gas welding machines, electric brazing machines, sintering machines for chemical processing, all for manufacturing micro and non-scale structures by the transformation of solder, welding, brazing, adhesive-bonding or sintering materials; machines, machine tools and power tools for applying connecting materials in form of pre-forms, pastes, films, foils, fluids or powder onto substrates by using chemical, electro-chemical and physical deposition techniques, namely, machinery for applying coatings ultrasonically to medical and industrial apparatus; machines, machine tools and power tools for manufacturing microconnections, by chemical or physical deposition, mechanical-, thermal- or optical transformation; machines for electrical, optical and mechanical bonding to build up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips; motors and engines, other than for land vehicles; machine couplings and transmission components, other than for land vehicles; devices in relation to micro-peripheral technologies, namely, machines for manufacture and processing of semi-conductors; apparatus, namely, electrostatic coating machines for applying connecting materials onto substrates, by using chemical, electro-chemical and physical deposition, dispense, placement and mechanical-, thermal- and optical transformation for manufacturing microconnections, in particular for building up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips

Treatment of materials by thermal, optical and mechanical interaction in relation to substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates, namely, optical radiation, laser radiation