U.S. federal trademark · Serial No. 85094173
Packaging articles to the order and specification of others, namely, packaging semiconductor chips and integrated circuits
Research and development for others of semiconductor related products and technology; Semiconductor packaging design; Integrated circuit design for others; Design for others of semiconductor substrates carrying integrated circuit; Testing for of semiconductors and related products; Quality management services, namely, quality evaluation and analysis, quality assurance, and quality control, in the field of semiconductors and related products; Providing quality assurance services in the field of semiconductors and related products
Etching of semiconductor wafers; Etching of integrated circuits; Manufacturing services for others in the field of semiconductors by wafer-level processing; Manufacturing services for others in the field of semiconductors by using wafer fabricating equipment; Custom manufacturing of semiconductor substrates; Custom manufacture semiconductor devices using substrate fabricating equipment; Manufacturing of semiconductor substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers in accordance with customer specifications
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.