printed circuits boards including ultra-thin aluminum separator plates with micro electroplated plated copper foil, ultrasonically bonded to one or both sides, used as combination material component and process consumable during the lay-up, fabrication, and lamination of printed circuit boards

'aluminum':8 'board':3,43 'bond':18 'circuit':2,42 'combin':26 'compon':28 'consum':31 'copper':15 'electropl':13 'fabric':37 'foil':16 'includ':4 'lamin':39 'lay':35 'lay-up':34 'materi':27 'micro':12 'one':20 'plate':10,14 'print':1,41 'process':30 'separ':9 'side':23 'thin':7 'ultra':6 'ultra-thin':5 'ultrason':17 'use':24

ABC ALUMINUM BONDED COPPER

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