U.S. federal trademark · Serial No. 86708507 · Reg. No. 5125242
Electronic circuit material, namely, an insulated dielectric substrate material which is clad on one or both sides with a conductive layer for fabricating electronic circuits; prepreg adhesive polymer film and bonding polymer film used for manufacturing electronic circuits
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.