Chemical mechanical planarization (CMP) and cleaning related products used in semiconductor manufacturing to enable lower manufacturing costs and higher productivity and yield, namely, advanced abrasive compositions in both suspension and solid form in controlled shapes and particle size distributions, namely, cerium oxide, manganese oxide, silicon oxide, aluminum oxide, zirconium oxide and combinations or reaction products thereof

'abras':25 'advanc':24 'aluminum':47 'cerium':41 'chemic':1 'clean':6 'cmp':4 'combin':52 'composit':26 'control':34 'cost':17 'distribut':39 'enabl':14 'form':32 'higher':19 'lower':15 'manganes':43 'manufactur':12,16 'mechan':2 'name':23,40 'oxid':42,44,46,48,50 'particl':37 'planar':3 'product':8,20,55 'reaction':54 'relat':7 'semiconductor':11 'shape':35 'silicon':45 'size':38 'solid':31 'suspens':29 'thereof':56 'use':9 'yield':22 'zirconium':49

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