MATERIAL MODIFICATION SERVICES NAMELY, TREATMENT AND MODIFICATION OF PRINTED CIRCUIT BOARDS AND COMPUTER BOARDS USING AN AUTOMATED PRINTING PROCESS BY WHICH WIRING CHANGES ARE DEPOSITED ONTO AN ADDED LAYER OF INSULATION PLACED OVER EXISTING WIRING TO CREATE A NEW LEVEL OF CIRCUITRY INCORPORATING AN ENGINEERING CHANGE ORDER

'ad':28 'autom':17 'board':11,14 'chang':23,46 'circuit':10 'circuitri':42 'comput':13 'creat':37 'deposit':25 'engin':45 'exist':34 'incorpor':43 'insul':31 'layer':29 'level':40 'materi':1 'modif':2,7 'name':4 'new':39 'onto':26 'order':47 'place':32 'print':9,18 'process':19 'servic':3 'treatment':5 'use':15 'wire':22,35

ELECTRONIC CIRCUIT COMPONENTS, NAMELY, PRINTED CIRCUITS AND PRINTED CIRCUIT BOARDS AND CONNECTORS AND CONDUCTORS FOR PRODUCTION AND REVISION THEREOF

'board':10 'circuit':2,6,9 'compon':3 'conductor':14 'connector':12 'electron':1 'name':4 'print':5,8 'product':16 'revis':18 'thereof':19

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