U.S. federal trademark · Serial No. 85204823 · Reg. No. 4163168
Synthetic cutting and grinding fluids
High precision, water-based diamond lapping slurry for cutting, grinding, lapping and polishing of metals, glass, ceramics, semi-conductor, stone, plastics and composite materials in the computer components industry, electronic components industry, aerospace industry, electro-optical materials fabrication industry, solar materials industry, ceramic materials industry, metal-working industry, microelectromechanical systems industry, and lapidary industry; oil-based diamond slurry for cutting, grinding, lapping and polishing of metals, glass, ceramics, semi-conductor, stone, plastics and composite materials in the computer components industry, electronic components industry, aerospace industry, electro-optical materials fabrication industry, solar materials industry, ceramic materials industry, metal-working industry, microelectromechanical systems industry, and lapidary industry; glycol-based diamond slurry for cutting, grinding, lapping and polishing of metals, glass, ceramics, semi-conductor, stone, plastics and composite materials in the computer components industry, electronic components industry, aerospace industry, electro-optical materials fabrication industry, solar materials industry, ceramic materials industry, metal-working industry, microelectromechanical systems industry, and lapidary industry; emulsion-based diamond slurry for cutting, grinding, lapping and polishing of metals, glass, ceramics, semi-conductor, stone, plastics and composite materials in the computer components industry, electronic components industry, aerospace industry, electro-optical materials fabrication industry, solar materials industry, ceramic materials industry, metal-working industry, microelectromechanical systems industry, and lapidary industry
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.