OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS; NON-CONTACT SENSORS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT, DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; WAFER MAPPING SENSORS

'ascertain':8 'base':2 'board':45 'circuit':44 'compon':81,92 'compris':54,80 'comput':84 'contact':31,51 'contour':12 'detector':65 'devic':4 'dimension':22,68 'featur':11 'hardwar':85 'high':20 'inspect':35,38,52,95 'lens':62 'light':60 'machin':77 'manufactur':72 'map':98 'measur':3,23,40,69 'non':30,50 'non-contact':29,49 'object':17 'optic':1,27,64 'part':26,76 'past':34,42 'placement':93 'precis':25,75 'process':73 'sensor':18,28,32,57,82,88,99 'shape':14 'softwar':47,87 'solder':33,41 'sourc':61 'speed':21 'surfac':10 'system':36,53,79,96 'therefor':48 'three':67 'use':6,90 'vision':78 'wafer':97

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