APAC

● Live · Registered

U.S. federal trademark · Serial No. 98452309 · Reg. No. 6857906

Mark

APAC

Status

Registered

Serial Number

98452309

Registration No.

6857906

Filing Date

March 6, 2024

Registration Date

October 24, 2024

Class(es)

Class 007

Owners

03 · Kyoto-shi, Kyoto, JP

03 · Kyoto-shi, Kyoto, JP

03 · Kyoto-shi, Kyoto, JP

machines for manufacturing semi-conductors; semi-conductor wafer processing equipment

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.