Insulating materials; insulating coating materials for use with printed circuit boards; insulating resin materials for liquid intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film-type intermediate dielectric materials for use on build-up boards; insulating coating materials for use with display panels; insulating materials in the nature of a solder mask for use with printed circuit boards; insulating protecting filling and plugging materials for use with holes of printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; dielectric material for use in three-dimensional printing.

'applic':89 'board':11,26,44,67,81,90,99 'build':24,42 'build-up':23,41 'circuit':10,66,80 'coat':4,46,83,92 'dielectr':18,36,100 'dimension':107 'display':51 'dri':31 'fill':70 'film':33 'film-typ':32 'flexibl':97 'hole':77 'insul':1,3,12,27,45,53,68,82,91 'intermedi':17,35 'liquid':16 'mask':61 'materi':2,5,14,19,29,37,47,54,73,84,93,101 'natur':57 'packag':88 'panel':52 'plug':72 'print':9,65,79,98,108 'protect':69 'resin':13,28 'solder':60 'three':106 'three-dimension':105 'type':34 'use':7,21,39,49,63,75,86,95,103

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