TESTING OF SILICONE WAFERS AND SEMICONDUCTOR DEVICES, INCLUDING, BACK-GRINDING, PROBING, TAPE AND REEL OPERATIONS, AND EVALUATION OF THE SILICONE WAFERS AND SEMICONDUCTOR DEVICES OF OTHERS FOR THE PURPOSE OF CERTIFICATION

'back':10 'back-grind':9 'certif':32 'devic':7,25 'evalu':18 'grind':11 'includ':8 'oper':16 'other':27 'probe':12 'purpos':30 'reel':15 'semiconductor':6,24 'silicon':3,21 'tape':13 'test':1 'wafer':4,22

PACKAGING SILICONE WAFERS AND SEMICONDUCTOR DEVICES FOR OTHERS

'devic':6 'other':8 'packag':1 'semiconductor':5 'silicon':2 'wafer':3

PACKAGING SEMICONDUCTOR DEVICES FOR TRANSPORT AND DELIVERY

'deliveri':7 'devic':3 'packag':1 'semiconductor':2 'transport':5

ASSEMBLY OF SILICONE WAFERS AND SEMICONDUCTOR DEVICES FOR OTHERS

'assembl':1 'devic':7 'other':9 'semiconductor':6 'silicon':3 'wafer':4

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