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AUTOLAM

● Live · Registered

U.S. federal trademark · Serial No. 88891906 · Reg. No. 018144656

Mark
AUTOLAM
Status
Registered
Serial Number
88891906
Registration No.
018144656
Filing Date
October 29, 2019
Registration Date
September 12, 2020
Class(es)
Class 017, Class 042

Owners

Ventec Electronics (Suzhou) Co., Ltd.
99 · Suzhou City, CN
Ventec Electronics (Suzhou) Co., Ltd.
99 · Suzhou City, CN
Ventec Electronics (Suzhou) Co., Ltd.
99 · Suzhou City, CN

Goods & Services

Electrical insulating materials; base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of circuit boards, namely, semi-processed plastic; plastic materials in the form of plates and sheets for use in the manufacture of circuit boards

Design of electrical insulating materials, base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of circuit boards, namely, semi-processed plastic, plastic materials in the form of plates and sheets for use in the manufacture of circuit boards

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.