Computer programming and consulting services in connection with writing and modifying computer programs for interconnecting semiconductor processing equipment, namely wafer slicing machines, die bonders, wire bonders, cleaning units, curing units, molding machines, packaging machines and assembly machines

'assembl':36 'bonder':24,26 'clean':27 'comput':1,12 'connect':7 'consult':4 'cure':29 'die':23 'equip':18 'interconnect':15 'machin':22,32,34,37 'modifi':11 'mold':31 'name':19 'packag':33 'process':17 'program':2,13 'semiconductor':16 'servic':5 'slice':21 'unit':28,30 'wafer':20 'wire':25 'write':9

Computer software for interconnecting semiconductor processing equipment, namely wafer slicing machines, die bonders, wire bonders, cleaning units, curing units, molding machines, packaging machines and assembly machines

'assembl':25 'bonder':13,15 'clean':16 'comput':1 'cure':18 'die':12 'equip':7 'interconnect':4 'machin':11,21,23,26 'mold':20 'name':8 'packag':22 'process':6 'semiconductor':5 'slice':10 'softwar':2 'unit':17,19 'wafer':9 'wire':14

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