U.S. federal trademark · Serial No. 50092007
Integrated circuit chips; printed circuit boards; semiconductors; integrated circuit substrates; microcircuits; integrated circuits; electronic circuits; semiconductor chips; electrical interconnect devices for integrated circuits, semiconductor chips, and semiconductor packages; electric power distribution boards; voltage surge protectors; voltage regulators for electric power; electrical power transducers; semiconductor packages comprised of semiconductor dies and electrical interconnects; protective housings for semiconductor chips; cooling devices for electronic components, namely, heat sinks and liquid cooling systems comprised of liquid coolers for electronic components; central processing unit (CPU) coolers.
Etching of integrated circuits for others; semiconductor packaging services, namely, encapsulation and sealing of semiconductor devices and integrated circuits for others; custom manufacture of semiconductor substrates, semiconductors, integrated circuits, and printed circuit boards to the order and specification of others
Research and development in the field of semiconductors, integrated circuits, semiconductor packaging, and semiconductor substrates; design of integrated circuits; design of semiconductor packaging and semiconductor substrates; testing and quality control inspection services for semiconductors and semiconductor-related products; quality control for others; technological consulting in the field of semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development.
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.