Trademark Search  /  BOND LAB

BOND LAB

○ Dead · Cancelled

U.S. federal trademark · Serial No. 76058924 · Reg. No. 2841869

Mark
BOND LAB
Status
Cancelled
Serial Number
76058924
Registration No.
2841869
Filing Date
June 1, 2000
Registration Date
May 11, 2004
Class(es)
Class 040, Class 042

Owners

BONDPLEX, LLC
16 · HUDSON, WI, US
BONDPLEX, LLC
16 · HUDSON, WI, US
BondPro Laboratories, LLC
99 · Hudson, WI, US

Goods & Services

Adhesive testing and adhesive process development

Custom manufacture of adhesives

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.