Trademark Search  /  BULC

BULC

○ Dead · Cancelled

U.S. federal trademark · Serial No. 78488026 · Reg. No. 3185525

Mark
BULC
Status
Cancelled
Serial Number
78488026
Registration No.
3185525
Filing Date
September 22, 2004
Registration Date
December 19, 2006
Class(es)
Class 009

Owners

NGK Spark Plug Co., Ltd.
03 · Nagoya City, JP
NGK Spark Plug Co., Ltd.
03 · Nagoya City, JP
NGK Spark Plug Co., Ltd.
03 · Nagoya City, JP

Goods & Services

Substrates for semi-conductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator; SAW(Surface Acoustic Wave) and filter; leadless chip carriers; interposers for semi-conductors, namely, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, namely, protective housings working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.