Trademark Search / BUMP ON FILM SUBSTRATE

BUMP ON FILM SUBSTRATE

○ Dead · Cancelled

U.S. federal trademark · Serial No. 76572112 · Reg. No. 4778279

Mark

Status

Cancelled

Serial Number

76572112

Registration No.

4778279

Filing Date

January 20, 2004

Registration Date

June 11, 2004

Class(es)

Class 009

Owners

03 · Osaka 571-8501, JP

03 · Osaka 571-8501, JP

Semiconductor devices; integrated circuits, electronic circuit substrates, printed circuits, semiconductor elements to be mounted on printed circuits

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.