U.S. federal trademark · Serial No. 79128976 · Reg. No. 4476584
Heat radiation transfer components for semiconductor devices made of composite materials composed of copper and molybdenum; heat spreaders for semiconductor devices made of composite materials composed of copper and molybdenum; heat radiation components for semiconductor devices; heat spreaders for semiconductor devices
[ Composite materials composed of copper and molybdenum for heat radiation and transfer; non-ferrous metals and their alloys ]
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