U.S. federal trademark · Serial No. 75564600 · Reg. No. 2564033
ELECTRONIC ASSEMBLY MACHINES FOR DISPENSING A VARIETY OF MATERIALS TO CIRCUIT BOARDS AND OTHER ELECTRONIC SUBSTRATES FOR SURFACE MOUNT ASSEMBLY AND SEMICONDUCTOR PACKAGING APPLICATIONS INCLUDING SOLDER PASTE, ADHESIVES, FLUXES AND CONDUCTIVE EPOXIES; MACHINES FOR DISPENSING AND PLACEMENT OF FLUXES AND SOLDER SPHERES ON CIRCUIT BOARDS AND OTHER ELECTRONIC SUBSTRATES; MACHINES FOR DISPENSING A VARIETY OF MATERIALS TO CIRCUIT BOARDS AND OTHER ELECTRONIC SUBSTRATES THAT INCLUDE A NON-CONTACT HEAT SOURCE FOR UNDERFILL AND ENCAPSULATION APPLICATIONS
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