U.S. federal trademark · Serial No. 97720478 · Reg. No. 7698272
Recorded software to control and modify polishing pad surface temperature while removing films and materials from wafers during semiconductor manufacture
Semiconductor wafer processing equipment, namely, hardware to control and modify polishing pad surface temperature while removing films and materials from wafers during semiconductor manufacture
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.