dielectric prepregs, films, and substrates for use in the manufacture of printed circuit boards (PCBs) and integrated circuit (IC) packages

'board':14 'circuit':13,18 'dielectr':1 'film':3 'ic':19 'integr':17 'manufactur':10 'packag':20 'pcbs':15 'prepreg':2 'print':12 'substrat':5 'use':7

Copper clad and unclad laminates for use in the manufacture of printed circuit boards (PCBs) and integrated circuit (IC) packages

'board':14 'circuit':13,18 'clad':2 'copper':1 'ic':19 'integr':17 'lamin':5 'manufactur':10 'packag':20 'pcbs':15 'print':12 'unclad':4 'use':7

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