CFB

Owner

Goods & Services

Processing and manufacturing of semiconductor wafers; assembling and processing of semiconductor elements; manufacturing, assembling and processing services of semiconductor components and integrated circuits; assembling and packing for semiconductors and integrated circuits; assembling and packaging of semiconductor wafers and integrated circuits; custom manufacturing of wafer components (thin films using epitaxial technology), wafer IC chips, printed circuit boards, and semiconductor circuits; custom manufacturing of semiconductor wafers for others (including bonding thin films using epitaxial technology to semiconductor wafers); custom manufacturing and processing of thin semiconductor films on semiconductor substrates.

(Class 42) Research in the field of semiconductor processing technology; testing, research and development relating to electronic circuits, semiconductor elements, integrated circuits and large scale integrated circuits; designing of electronic circuits, semiconductor elements, integrated circuits and large scale integrated circuits.

Semiconductor wafers; semiconductor substrates; semiconductor elements; light emitting diode chips; light emitting diode elements; photodiodes; integrated circuits; diode arrays; semiconductors; semiconductor devices formed by bonding heterogeneous materials; semiconductor devices; semiconductor wafers with thin films bonded together using epitaxial technology; optical semiconductors.