U.S. federal trademark · Serial No. 99639470
Abrasive free chemical solutions for chemical mechanical planarization (CMP) for polishing semiconductors, metals, metal alloys, and dielectric materials
Pads for chemical mechanical planarization (CMP) machines for polishing and smoothing metals, metal alloys, semiconductors, and dielectric materials for abrasive free chemical mechanical planarization (CMP)
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.