Cleaning services for chamber components of semiconductor process equipment; chemical cleaning services, namely, wet chemical tank cleaning, acids, bases, solvent, solvent vapor, and surfactant cleaning, wet chemical stripping and etching; high purity cleaning services, namely, CO2 snow and pellet cleaning, ultrasonic cleaning, high-pressure water cleaning, thermal process cleaning, mechanical polishing, bead blasting, bonding, Twin Wire Arc Spray (TWAS), and Ultra Pure Water (UPW) rinse cleaning

'acid':18 'arc':58 'base':19 'bead':53 'blast':54 'bond':55 'chamber':4 'chemic':10,15,27 'clean':1,11,17,25,33,40,42,47,50,67 'co2':36 'compon':5 'equip':9 'etch':30 'high':31,44 'high-pressur':43 'mechan':51 'name':13,35 'pellet':39 'polish':52 'pressur':45 'process':8,49 'pure':63 'puriti':32 'rins':66 'semiconductor':7 'servic':2,12,34 'snow':37 'solvent':20,21 'spray':59 'strip':28 'surfact':24 'tank':16 'thermal':48 'twas':60 'twin':56 'ultra':62 'ultrason':41 'upw':65 'vapor':22 'water':46,64 'wet':14,26 'wire':57

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