substrate or interposer for use with semiconductor chips, namely, dielectrically layer embedded with conductive columns that may be fanned out to specific patterns of contact pads for electronic interconnections between chip and next level board

'board':35 'chip':8,31 'column':15 'conduct':14 'contact':25 'dielectr':10 'electron':28 'embed':12 'fan':19 'interconnect':29 'interpos':3 'layer':11 'level':34 'may':17 'name':9 'next':33 'pad':26 'pattern':23 'semiconductor':7 'specif':22 'substrat':1 'use':5

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