U.S. federal trademark · Serial No. 75515056 · Reg. No. 2283066
Thermally conductive chemical adhesive compounds in both paste and film formats that cure in situ or with heat to form strong bonding between heat generating devices and heat-sinks or heat-spreaders for use in the power conversion, power supply, motor control, computer and general electronic industries
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.