U.S. federal trademark · Serial No. 75733700
ELECTRONIC COMPONENTS, NAMELY, SOLDER BUMPED SEMICONDUCTOR SILICON CHIPS AND WAFERS; SOLDER BUMPED ELECTRONIC SUBSTRATES FOR USE IN FURTHER MANUFACTURE OF ELECTRONICS; AND SOLDER BUMPED ELECTRICAL CIRCUIT BOARDS
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.