U.S. federal trademark · Serial No. 85219599
Printed circuit boards; chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, systems and devices utilizing semiconductors comprising dies, substrates, interposers, wire bond and solder bumps, circuitized lead frames and circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuits
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.