Grinding pads and polishing pads used in chemical and mechanical polishing and specifically designed for use in semiconductor wafer fabricating machines; polishing pads and grinding pads used to polish glass and specifically designed for use in semiconductor wafer fabricating machines; polishing pads and grinding pads used to polish glass and specifically designed for use in machines for making LEDs used in the optoelectronics industry; polishing pads and grinding pads used to polish glass and specifically designed for use in machines for making displays used in the optoelectronics industry

'chemic':8 'design':14,33,52,76 'display':83 'fabric':20,39 'glass':30,49,73 'grind':1,25,44,68 'industri':64,88 'led':59 'machin':21,40,56,80 'make':58,82 'mechan':10 'optoelectron':63,87 'pad':2,5,23,26,42,45,66,69 'polish':4,11,22,29,41,48,65,72 'semiconductor':18,37 'specif':13,32,51,75 'use':6,16,27,35,46,54,60,70,78,84 'wafer':19,38

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