U.S. federal trademark · Serial No. 79413983 · Reg. No. 8105682
Assembling integrated circuit photomasks and electronic and computer chips for others; processing of semiconductor wafers; encapsulation of semiconductors; providing information relating to material treatment; customized semiconductor wafer manufacturing services under customer consignment and specifications; semiconductor module customization services under customer consignment and specifications; customized manufacturing services for wafers, semiconductors and integrated circuits under customer consignment and specifications; burnishing by abrasion; laminating of semiconductor wafers; grinding; custom manufacturing of semiconductor circuits; custom manufacture of semiconductor wafers
Research in the area of semiconductor processing technology; design of semiconductor chips and semiconductor component parts; design of integrated circuits; design of semiconductor packaging; technological research in the field of advanced semiconductor packaging technology, advanced memory technology and integrated circuit solutions; research and development of new products for others; technology consultation in the field of artificial intelligence (AI); technical research in the field of manufacture of silicon photonic chips; microchip design services; research in the field of telecommunications technology
Semiconductor wafers; wafers for integrated circuits; structured semi-conductor wafers; integrated circuits; electronic chips for the manufacture of integrated circuits; electronic semi-conductors; silicon wafers; semiconductors; integrated circuit modules
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.