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CU-BRITE

● Live · Registered

U.S. federal trademark · Serial No. 98428920 · Reg. No. 6338538

Mark
CU-BRITE
Status
Registered
Serial Number
98428920
Registration No.
6338538
Filing Date
March 1, 2024
Registration Date
January 8, 2021
Class(es)
Class 001

Owners

JCU CORPORATION
03 · Tokyo, JP
JCU CORPORATION
03 · Tokyo, JP
JCU CORPORATION
03 · Tokyo, JP

Goods & Services

Industrial chemicals; chemicals for use in plating; metal plating solution; chemical metal plating solution; metal plating chemical compositions, namely, electrolytic acid copper solution; metal plating solution additive; chemical additive for use in the manufacture of metal plating solution; chemical metal plating solution additive; metal plating additives; chemical additives for use in metal plating; chemical metal plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical agents for use in the plating industry for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and plating chemicals for use in package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; metal plating solution, metal plating solution additive, metal plating additives for use in package substrate, and printed circuit boards; chemical metal plating solution, chemical metal plating solution additive, chemical metal plating additives for use in package substrate, and printed circuit boards; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in package substrate, and printed circuit boards

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.