CU.P BOND

Owner

Goods & Services

Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services

Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect