U.S. federal trademark · Serial No. 86786223
Thermal interface materials, namely, nanocopper oligomeric adhesive binders and conductive fillers for thermal management, thermal grounding, transferring and removing heat, connecting electronic materials to thermal ground planes, power supplies, power control and switching, computer applications, graphics processing units, lighting systems, electric switches, power control modules
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.