Thermal interface materials, namely, nanocopper oligomeric adhesive binders and conductive fillers for thermal management, thermal grounding, transferring and removing heat, connecting electronic materials to thermal ground planes, power supplies, power control and switching, computer applications, graphics processing units, lighting systems, electric switches, power control modules

'adhes':7 'applic':35 'binder':8 'comput':34 'conduct':10 'connect':21 'control':31,44 'electr':41 'electron':22 'filler':11 'graphic':36 'ground':16,26 'heat':20 'interfac':2 'light':39 'manag':14 'materi':3,23 'modul':45 'name':4 'nanocopp':5 'oligomer':6 'plane':27 'power':28,30,43 'process':37 'remov':19 'suppli':29 'switch':33,42 'system':40 'thermal':1,13,15,25 'transfer':17 'unit':38

CU-THERM

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