machine vision and inspection products incorporating a two- and three-dimensional camera-based inspection method for use in inspecting various package types including "ball grid arrays," "chip scale packages," "quad flat packs" and "thin small outline packages" used in the back end semi-conductor industry

'array':28 'back':43 'ball':26 'base':15 'camera':14 'camera-bas':13 'chip':29 'conductor':47 'dimension':12 'end':44 'flat':33 'grid':27 'includ':25 'incorpor':6 'industri':48 'inspect':4,16,21 'machin':1 'method':17 'outlin':38 'pack':34 'packag':23,31,39 'product':5 'quad':32 'scale':30 'semi':46 'semi-conductor':45 'small':37 'thin':36 'three':11 'three-dimension':10 'two':8 'type':24 'use':19,40 'various':22 'vision':2

CYBERSTEREO

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