Trademark Search  /  DI PAK THE FUTURE OF CERAMIC PACKAGING

DI PAK THE FUTURE OF CERAMIC PACKAGING

○ Dead · Abandoned

U.S. federal trademark · Serial No. 75370818

Mark
DI PAK THE FUTURE OF CERAMIC PACKAGING
Status
Abandoned
Serial Number
75370818
Filing Date
October 9, 1997
Class(es)
Class 009

Owners

Dielectric Laboratories, Inc.
03 · Cazenovia, NY, US
Dielectric Laboratories, Inc.
03 · Cazenovia, NY, US

Goods & Services

Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.