temporary reusable carriers emulating a packaged semiconductor with a custom interconnect substrate, used to allow burn-in and test at the die level for producing known good die (KGD), for commercial use in the electronics and semiconductor fields

'allow':15 'burn':17 'burn-in':16 'carrier':3 'commerci':32 'custom':10 'die':23,29 'electron':36 'emul':4 'field':39 'good':28 'interconnect':11 'kgd':30 'known':27 'level':24 'packag':6 'produc':26 'reusabl':2 'semiconductor':7,38 'substrat':12 'temporari':1 'test':20 'use':13,33

DIEPAK KNOWN GOOD DIE SOLUTIONS

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