Cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor, glass and ceramic wafers; polishing machines for semiconductor, glass and ceramic wafers; metalworking machines utilizing laser beams for cutting; machine tools for cutting namely, cutting blades; machine grinding tools for grinding machines; machine polishing tools for polishing machines [ ; chemical processing machines and apparatus, namely, etching machines and evaporating machines, all for chemical processing; semiconductor manufacturing machines and machine systems ]

'apparatus':55 'beam':29 'blade':38 'ceram':7,15,23 'chemic':51,64 'cut':1,31,35,37 'etch':57 'evapor':60 'glass':5,13,21 'grind':9,40,43 'laser':28 'machin':2,10,18,26,32,39,44,45,50,53,58,61,68,70 'manufactur':67 'metalwork':25 'name':36,56 'polish':17,46,49 'process':52,65 'semiconductor':4,12,20,66 'system':71 'tool':33,41,47 'util':27 'wafer':8,16,24

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