U.S. federal trademark · Serial No. 85492910 · Reg. No. 4239177
Wafer level package comprising silicon wafers; semiconductor devices; semiconductor substrate; structured semiconductor wafers; product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; integrated circuit chips; integrated circuits; electronic integrated circuits; circuit boards
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.