DTB

Owners

Goods & Services

Semiconductor manufacturing machines; electric irradiation apparatus for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for use in the manufacture of semiconductors; Bonding apparatus for use in bonding semiconductor chips in the manufacture of semiconductors; Die bonders, namely, machine for chip mounting for use in the manufacture of semiconductors; Mounting apparatus for mounting IC chips and other electronic components onto circuit boards for use in the manufacture of semiconductors

Plastic semi-worked products, namely, adhesive-coated films for use in manufacture; Adhesive or adhesive-coated plastic films, namely, plastic films for industrial and commercial packing use; Adhesive or adhesive-coated plastic sheets for use in manufacturing; Adhesive tapes and self-adhesive tapes for use manufacturing for use in the processing of semiconductors; Adhesive mounting tapes and self-adhesive mounting tapes for use in the mounting of semiconductors; Plastic tapes for use in the manufacturing of semiconductors for the peeling of tapes for semiconductor wafer processing; Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts; Protective plastic tapes use in the manufacturing of semiconductors for the rear surfaces of semiconductor chips

Laminating of adhesive tapes and self-adhesive tapes; Manufacturing of semiconductors, namely, peeling of adhesive tapes and self-adhesive tapes for the purpose of transferring chips onto semiconductors; Treatment and processing of materials, namely, plastic films and sheets for the manufacture of semiconductors; Treatment of materials, namely, resin, through electron beam irradiation; Treatment and processing of materials for use in the manufacturing of semiconductors or and wafers; Powder coating services, namely, resin coating for the processing of semiconductors and wafers; Rental of semiconductor manufacturing machines and apparatus