U.S. federal trademark · Serial No. 75547340 · Reg. No. 2564021
components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.