components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit

'array':37 'ball':35 'ball-grid':34 'bismaleeimid':18 'bt':20 'chip':30 'circuit':6,29,47 'compon':1 'constitut':40 'fabric':14 'grid':36 'insul':9 'integr':5,28,46 'lamin':22 'materi':13 'name':7 'packag':4,26,38,45 'part':42 'plastic':33 'resin':21 'silicon':16 'substrat':12 'triazin':19 'use':2,24 'wafer':10

DTI DTI

Owners

Goods & Services