ELECTRONIC COMPONENTS, IN PARTICULAR ASSEMBLED AND BARE PRINTED CIRCUIT BOARDS, MULTI-CHIP MODULES AND SUBSTRATES THEREFORE, SINGLE-CHIP AND MULTI-CHIP ELECTRONIC PACKAGES COMPRISED OF BALL-GRID ARRAYS AND MICRO BALL-GRID ARRAYS, AND INTERPOSERS AND CHIP CARRIERS THEREFOR

'array':32,38 'assembl':5 'ball':30,36 'ball-grid':29,35 'bare':7 'board':10 'carrier':43 'chip':13,20,24,42 'circuit':9 'compon':2 'compris':27 'electron':1,25 'grid':31,37 'interpos':40 'micro':34 'modul':14 'multi':12,23 'multi-chip':11,22 'packag':26 'particular':4 'print':8 'singl':19 'single-chip':18 'substrat':16 'therefor':17,44

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