COMPUTER CHIPS; ELECTRIC CIRCUIT BOARDS; SEMI-CONDUCTORS; SEMI-CONDUCTOR SUBSTRATES, NAMELY, SILICON WAFERS FOR SEMICONDUCTORS; INTERFACE CARDS FOR DATA PROCESSING EQUIPMENT IN THE FORM OF PRINTED CIRCUITS; MICROCIRCUITS; INTEGRATED CIRCUITS; ELECTRONIC CIRCUITS; PRINTED CIRCUIT BOARDS; SEMI-CONDUCTOR CHIPS; SEMI-CONDUCTOR POWER ELEMENTS; ALUMINUM OXIDE SUBSTRATE FOR INTEGRATED CIRCUITS; PRINTED CIRCUIT SUBSTRATES; INTEGRATED CIRCUIT SOCKETS (IC SOCKETS); VERY LARGE SCALE INTEGRATED CIRCUITS (VLSI); INTEGRATED CIRCUIT BOARDS; SILICON CHIPS; SILICON WAFERS; CIRCUIT BOARDS; LARGE SCALE INTEGRATED CIRCUITS (LSI)

'aluminum':47 'board':5,37,69,75 'card':19 'chip':2,41,71 'circuit':4,29,32,34,36,52,54,57,65,68,74,79 'comput':1 'conductor':8,11,40,44 'data':21 'electr':3 'electron':33 'element':46 'equip':23 'form':26 'ic':59 'integr':31,51,56,64,67,78 'interfac':18 'larg':62,76 'lsi':80 'microcircuit':30 'name':13 'oxid':48 'power':45 'print':28,35,53 'process':22 'scale':63,77 'semi':7,10,39,43 'semi-conductor':6,9,38,42 'semiconductor':17 'silicon':14,70,72 'socket':58,60 'substrat':12,49,55 'vlsi':66 'wafer':15,73

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