U.S. federal trademark · Serial No. 98660799 · Reg. No. 7761225
Burnishing by abrasion; Custom manufacture of semiconductor circuits; Custom manufacture of semiconductor devices; Custom manufacture of semiconductor wafers; Encapsulation of semi-conductors; Metal plating; Metal treating; Processing of epoxy resin; Treatment of materials by laser beam; Water treating
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.