U.S. federal trademark · Serial No. 97041750
Chemicals used in metallization of circuit boards and integrated chips; chemicals used for plating through holes in electronic circuit boards; chemicals for plating high aspect ratio through holes and micro vias in circuit boards; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.