Hermetic glass-to-metal packages to encapsulate electronic components Direct bonded copper substrates and heat sinks to support electronic components Thermostats to control over-heating of small and major appliances Oxygen and humidity sensors for medical applications and combustion control

'applianc':32 'applic':39 'bond':12 'combust':41 'compon':10,21 'control':24,42 'copper':13 'direct':11 'electron':9,20 'encapsul':8 'glass':3 'glass-to-met':2 'heat':16,27 'hermet':1 'humid':35 'major':31 'medic':38 'metal':5 'over-h':25 'oxygen':33 'packag':6 'sensor':36 'sink':17 'small':29 'substrat':14 'support':19 'thermostat':22

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