U.S. federal trademark · Serial No. 77869721 · Reg. No. 4372801
non-abrasive polishing pads for chemical-mechanical planarizing or chemical-mechanical polishing (CMP) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.