Trademark Search / ELITECSP

ELITECSP

○ Dead · Cancelled

U.S. federal trademark · Serial No. 78843235 · Reg. No. 3332305

Mark

ELITECSP

Status

Cancelled

Serial Number

78843235

Registration No.

3332305

Filing Date

March 22, 2006

Registration Date

November 6, 2007

Class(es)

Class 040

Owners

FlipChip International, LLC

11 · Phoenix, AZ, US

FlipChip International, LLC

11 · Phoenix, AZ, US

FlipChip International, LLC

11 · Phoenix, AZ, US

Goods & Services

Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.