U.S. federal trademark · Serial No. 90581990 · Reg. No. 6847967
Polishing pads for polishing machines for use in the manufacture of integrated circuit wafers, semiconductor wafers, integrated circuits, hard disk drives and chipsets; Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of integrated circuit wafers, semiconductor wafers, integrated circuits, hard disk drives and chipsets
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.